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HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HT200205 Issued Date : 1993.05.15 Revised Date : 2002.05.03 Page No. : 1/4 HT882 NPN EPITAXIAL PLANAR TRANSISTOR Description The HT882 is designed for using in output stage of 1w audio amplifier, voltage regulator, DC-DC converter and relay driver. Absolute Maximum Ratings (Ta=25C) TO-126 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ....................................................................................... 1 W Total Power Dissipation (Tc=25C) ..................................................................................... 10 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage....................................................................................... 40 V BVCEO Collector to Emitter Voltage.................................................................................... 30 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current (DC) ...................................................................................................... 3 A IC Collector Current (Pulse) .................................................................................................. 7 A IB Base Current (DC) ......................................................................................................... 0.6 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 40 30 5 30 100 Typ. 0.3 1 150 200 90 45 Max. 1 1 0.5 2 500 Unit V V V uA uA V V Test Conditions IC=100uA IC=1mA IE=10uA VCB=30V VEB=3V IC=2A, IB=0.2A IC=2A, IB=0.2A IC=20mA, VCE=2V IC=1A, VCE=2V IC=0.1A, VCE=5V VCB=10V, f=1MHz, IE=0 *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF Classification Of hFE2 Rank Range Q 100-200 P 160-320 E 250-500 HT882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HT200205 Issued Date : 1993.05.15 Revised Date : 2002.05.03 Page No. : 2/4 Saturation Voltage & Collector Current 125 C o 75 C o 25 C o Saturation Voltage (mV) 75 C 100 o hFE 100 25 C o hFE @ VCE=2V 10 1 10 100 1000 10000 10 1 125 C VCE(sat) @ IC=10IB o 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 1000 Saturation Voltage & Collector Current Saturation Voltage (mV) 75 C o Saturation Voltage (mV) 75 C o 100 125 C o 100 25 C o 125 C o 25 C o VCE(sat) @ IC=40IB 10 1 10 100 1000 10000 10 1 10 100 VCE(sat) @ IC=20IB 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 100 Capacitance & Reverse-Biased Voltage Saturation Voltage (mV) 75 C 1000 25 C o o Capacitance (pF) Cob 10 125 C VBE(sat) @ IC=10IB 100 1 10 100 1000 10000 1 0.1 1 10 100 o Collector Current-IC (mA) Reverse-Biased Voltage (V) HT882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HT200205 Issued Date : 1993.05.15 Revised Date : 2002.05.03 Page No. : 3/4 Cutoff Frequency & Collector Current 1000 10 Safe Operating Area PT=1mS Cutoff Frequency (MHz).. . 100 VCE=5V Collector Current-IC (A) PT=1S PT=100mS 1 10 1 1 10 100 1000 0.1 1 10 100 Collector Current (mA) Forward Voltage-VCE (V) HT882 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-126 Dimension D A B 123 G C I E J K M Spec. No. : HT200205 Issued Date : 1993.05.15 Revised Date : 2002.05.03 Page No. : 4/4 Marking: 3 Date Code H 882 T Rank Control Code 4 Style: Pin 1.Emitter 2.Collector 3.Base F H L 1 2 3-Lead TO-126 Plastic Package HSMC Package Code: T *: Typical DIM 1 2 3 4 A B C D E Inches Min. Max. *3 *3 *3 *3 0.1500 0.1539 0.2752 0.2791 0.5315 0.6102 0.2854 0.3039 0.0374 0.0413 Millimeters Min. Max. *3 *3 *3 *3 3.81 3.91 6.99 7.09 13.50 15.50 7.52 7.72 0.95 1.05 DIM F G H I J K L M Inches Min. Max. 0.0280 0.0319 0.0480 0.0520 0.1709 0.1890 0.0950 0.1050 0.0450 0.0550 0.0450 0.0550 *0.0217 0.1378 0.1520 Millimeters Min. Max. 0.71 0.81 1.22 1.32 4.34 4.80 2.41 2.66 1.14 1.39 1.14 1.39 *0.55 3.50 3.86 Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HT882 HSMC Product Specification |
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